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Laser Cutting PCBs: The Technology Behind Our Depaneling Machines

Laser Depaneling is the most innovative and promising technique for cutting and separating printed circuit boards from the panel and is differentiated from the classic separation methods in particular by its flexibility and stress-free processing.

What is (Laser-)Depaneling?

Laser Depaneling is one of the most modern and promising processes for separation PCBs from the overall panel. During the depaneling process, the previously manufactured and assembled printed circuit boards (PCBs) are cut out of the panel using a suitable separation process/tool. In the case of laser depaneling, the singulation process is performed by a focused laser beam that ablates the material layer by layer. The laser method - especially applied by LPKF machines - offers significant advantages compared to conventional mechanical separation methods.

How Does the Process Work?

In case of laser depaneling, the thermal energy of the laser is used to remove the material path by path / layer by layer. With each repitition, a pre-defined thickness of the material is ablated and vaporised. The resulting fumes are extracted during the process by a powerful suction system. Due to the small particles and the powerful suction, the deposition of residues is reduced to a minimum. In addition, the thermal energy is regulated during the entire process in such a way that, depending on the specific requirements, there is no or only very little carbonisation of the material.

Due to the layer-by-layer ablation process of the laser, it is not only possible to cut through the boards completely, but also to remove individual layers or predefined thicknesses of the material. Due to the precision and filigree of the laser, ablations can be performed with an accuracy of a few µm.

Choose from the LPKF System Portfolio

Various laser options and different system characteristics allow you to find the right balance between cost and quality for your depaneling applications, depending on the field of usage. LPKF laser technology is highly productive for both special applications and large series. We will gladly assist you in selecting the perfect solution for you with regard to our range of options:

  • Laser sources: ultraviolet and green lasers with pulse durations in nano- and picosecond range
  • Working area: small and large working areas covering all standard formats
  • Automation level: stand alone or as part of a fully automated and/or integrated production line
LPKF CuttingMaster 2000 PCB Depaneling System

The Most Cost-Efficient Laser Depaneling Systems

Cost-effectiveness, flexibility, space savings, design freedom – laser depaneling with the CuttingMaster 2000 opens up numerous potentials.

LPKF CuttingMaster 3000 PCB Depaneling System

The Most Precise Laser Depaneling Systems

The CuttingMaster 3000 is characterised by a large working area of up to 500 mm x 350 mm, high processing speed and outstanding precision.

MicroLine 5000

The Allrounder Systems

The field-proven LPKF MicroLine 5000 systems can be equiped wih a variety of different laser sources. The largest working area of 533 mm x 610 mm makes them a versatile tool for the PCB industry.

All LPKF-CuttingMaster- and MircoLine-Systems are available as stand-alone or inline solutions and can be specifically supplemented with LPKF's own automation solutions.

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